small-outline package integrated circuit
- small-outline package integrated circuit
- mažakorpusis integrinis grandynas
statusas T sritis radioelektronika
atitikmenys: angl. low-profile integrated circuit; small-outline package integrated circuit
vok. integrierter Schaltkreis im SO-Gehäuse, n
rus. интегральная схема в малогабаритном корпусе, f
pranc. circuit intégré en boîtier de petites dimensions, m; circuit intégré en petit boîtier, m
Radioelektronikos terminų žodynas. – Vilnius : BĮ UAB „Litimo“.
Kazimieras Gaivenis, Gytis Juška, Vidas Kalesinskas.
2000.
Look at other dictionaries:
Thin small-outline package — Thin small outline packages, or TSOPs are a type of surface mount IC package. They are notably very low profile (about 1mm) and have tight lead spacing (as low as 0.5mm).They are frequently used for RAM or Flash memory ICs dues to their high pin… … Wikipedia
low-profile integrated circuit — mažakorpusis integrinis grandynas statusas T sritis radioelektronika atitikmenys: angl. low profile integrated circuit; small outline package integrated circuit vok. integrierter Schaltkreis im SO Gehäuse, n rus. интегральная схема в… … Radioelektronikos terminų žodynas
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Small-outline integrated circuit — A small outline integrated circuit (SOIC) is a surface mounted integrated circuit (IC) package which occupies an area about 30 50% less than an equivalent DIP, with a typical thickness that is 70% less. They are generally available in the same… … Wikipedia
Integrated circuit packaging — Early USSR made integrated circuit Integrated circuit packaging is the final stage of semiconductor device fabrication per se, followed by IC testing.Packaging in ceramic or plastic prevents physical damage and corrosion and supports the… … Wikipedia
circuit intégré en boîtier de petites dimensions — mažakorpusis integrinis grandynas statusas T sritis radioelektronika atitikmenys: angl. low profile integrated circuit; small outline package integrated circuit vok. integrierter Schaltkreis im SO Gehäuse, n rus. интегральная схема в… … Radioelektronikos terminų žodynas
circuit intégré en petit boîtier — mažakorpusis integrinis grandynas statusas T sritis radioelektronika atitikmenys: angl. low profile integrated circuit; small outline package integrated circuit vok. integrierter Schaltkreis im SO Gehäuse, n rus. интегральная схема в… … Radioelektronikos terminų žodynas
Dual in-line package — PDIP redirects here. PDIP may also refer to Indonesian Democratic Party – Struggle. Three 14 pin (DIP14) plastic dual in line packages containing IC chips … Wikipedia
Quad Flat Package — 44 poliges QFP (ein Mikroprozessor Z80) Quad Flat Package (QFP) bezeichnet in der Elektronik eine weit verbreitete Gehäusebauform für Integrierte Schaltungen. Die Anschlüsse (Pins) befinden sich an den vier Seiten des flachen Gehäuses. QFP werden … Deutsch Wikipedia
electronic substrate and package ceramics — Introduction advanced industrial materials that, owing to their insulating qualities, are useful in the production of electronic components. Modern electronics are based on the integrated circuit, an assembly of millions of… … Universalium
